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Evaluation Findings of Bondade CU-31 Bonding Solution

Bondade CU-31 Bonding Solution

Evaluation Findings of Bondade CU-31 Bonding Solution

Technical Evaluation Report

Highway Innovative Technology Innovation Center

CERF Reports HITEC 98-14

1998 / 58 pp.

Soft Cover - In Stock
$44.00 List / $33.00ASCE Member
Stock No. 40348 / ISBN: 9780784403488

Prepared by the Highway Innovative Technology Evaluation Center (HITEC), a CERF Service Center.

The report describes a HITEC evaluation of Bondade CU-31 Bonding Solution, manufactured by Transpo Industries. The report describes a three-year program of field testing and evaluation designed to determine the effectiveness of Bondade CU-31 in extending the service life of pothole repairs.

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