Evaluation Findings of Bondade CU-31 Bonding Solution
Technical Evaluation Report
Highway Innovative Technology Innovation Center
CERF Reports HITEC 98-14
1998 / 58 pp.
Soft Cover - In Stock
$44.00 List / $33.00ASCE Member
Stock No. 40348 / ISBN: 9780784403488
Prepared by the Highway Innovative Technology Evaluation Center (HITEC), a CERF Service Center.
The report describes a HITEC evaluation of Bondade CU-31 Bonding Solution, manufactured by Transpo Industries. The report describes a three-year program of field testing and evaluation designed to determine the effectiveness of Bondade CU-31 in extending the service life of pothole repairs.